Surface mount antenna contacts

ABSTRACT

A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.

BACKGROUND

1. Field of the Invention

This invention relates to antenna devices and more particularly tosystems and methods for coupling antennas to printed circuit boards.

2. Description of Related Art

The use of wireless communication devices for data networking continuesto grow at a rapid pace. Data networks that use “WiFi” (“WirelessFidelity”), also known as “Wi-Fi,” are relatively easy to install,convenient to use, and supported by the IEEE 802.11 standard. WiFi datanetworks also provide performance that makes WiFi a suitable alternativeto a wired data network for many business and home users.

WiFi networks operate by employing wireless access points that provideusers, having wireless (or “client”) devices in proximity to the accesspoint, with access to varying types of data networks such as, forexample, an Ethernet network or the Internet. The wireless access pointsinclude a radio that operates according to the standards specified indifferent sections of the IEEE 802.11 specification. Generally, radiosin the access points communicate with client devices by utilizingomni-directional antennas that allow the radios to communicate withclient devices in any direction. The access points are then connected(by hardwired connections) to a data network system that completes theaccess of the client device to the data network. The different standardsunder IEEE 802.11 define ‘channels’ that wireless devices, or clients,use when communicating with an access point.

These wireless access points and client devices typically have externalor internal antennas. If internal antennas are employed in wirelessaccess points and client devices, they are often connected to printedcircuit boards (PCBs) by directly soldering the antenna to the PCB orwith expensive connectors. Both approaches suffer from increasing costeither directly with hardware cost or indirectly with cost associatedwith complex soldering approaches caused by the size and angle of theinstalled antenna. Also, the physical size of connectors used in otherapproaches often makes use of those connectors impossible in highlyintegrated assemblies.

Thus, there is a need for a system and approach for rapidly and costeffectively installing antennas on PCBs.

SUMMARY

A system and method for surface mounting contacts for use in highdensity assemblies where more than one PCB is required to be connectedelectrically, such as an antenna PCB to a controller PCB regardless ofsignal type (RF, digital or analog environment while reducing direct andindirect cost. The contact device is formed from a single material andmounted on a first PCB is biased in a first position when at rest and ina second position when in electrical contact with a second PCB.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a contact device in accordance with anexample implementation of an embodiment of the invention.

FIG. 2 is a top and side view of the contact device of FIG. 1.

FIG. 3 is a perspective view of the contact device of FIGS. 1 and 2 in acontact application with vertical PCB in accordance with an exampleimplementation of an embodiment of the invention.

FIG. 4 is a perspective side view of the vertical PCB and horizontal PCBof FIG. 3.

FIG. 5 is a perspective view of the vertical PCB of FIG. 3.

FIG. 6 is a perspective view of a contact device between a vertical PCBand horizontal PCB in accordance with another example implementation ofan embodiment of the invention.

FIG. 7 is a flow diagram of an application of the contact device ofFIGS. 1 and 2 on to a PCB in accordance with an example implementationof an embodiment of the invention.

DETAILED DESCRIPTION

In the following description of the preferred embodiment, reference ismade to the accompanying drawings that form a part hereof, and whichshow, by way of illustration, a specific embodiment in which theinvention may be practiced. Other embodiments may be utilized andstructural changes may be made without departing from the scope of thepresent invention.

In FIG. 1, a perspective view 100 of a contact device 102 in accordancewith an example implementation of an embodiment of the invention isshown. The contact device 102 may be formed by micro stamping aconductive metal alloy; examples of such alloys may include brass withnickel and silver as described in the Copper Development Association,Copper Alloy Spring Materials, CDA Publication TN12, 1973. It isdesirable to choose a conductive alloy that is a spring material withreduced corrosion characteristics. The contact device is created with araised portion 104 and may also have an anchor portion 106 or pad. Theraised portion 104 may be formed out of the alloy by having a first bend108 that raises a portion of the contact device 104 and a second bend110 that is in the opposite direction of the first bend

Turning to FIG. 2, a top and side view 200 of the contact device 102 ofFIG. 1 is shown. The contact device 102 has a first position withoutcontacting a vertical PCB and a second position when engaged with thevertical PCB board. The contact device 102 is biased to the firstposition and exerts a biasing force in the second position against aninserted vertical PCB as shown in FIG. 3. The biasing force is createdupon downward pressure being placed upon a raised portion 104 of thecontact device. The raised portion 104 may be compressed by the verticalPCB board with the raised section 104 being moved from the biased firstposition to the second position. An anchor point 106 or pad may alsoinclude a protruding member 202 that aids in the anchoring of thecontact device.

In FIG. 3, a perspective view 300 of the contact device 102 of FIGS. 1and 2 mounted on a PCB 302 connecting with a vertical PCB 304 inaccordance with an example implementation of an embodiment of theinvention. The vertical PCB 304 may have microstrip contact lines, suchas 306 and ground pads 308 and 310 that may wrap on the side wall of thePCB 304 substrate (the side walls may contain conductive metal forconnection with the microstrip contact lines). The boundaries for thewrap around microstrip contact lines and ground pads may be achieved bydrilling/routing operations. To ensure that the vertical PCB andmicrostrip contact lines/pads of PCB 304 create enough pressure againstthe contacts on PCB 302, such as contact 102 and bias the contacts to asecond position, a one or more guides (312 and 314) may be used.

Turning to FIG. 4, perspective side view of the vertical PCB 304 andhorizontal PCB 302 of FIG. 3 is depicted. The vertical PCB 304 is shownwith the microstrip contact line 306 extending to the edge of verticalPCB 304 and then wrapping around the edge of the PCB (wraparoundmetallization 402). The microstrip contact line 306 may be extended abit more on the far side of the vertical PCB 304, and then plated(stitched) through hole 404 in order to prevent the wraparound contactfrom peeling off. When the vertical PCB 304 is placed over thehorizontal PCB 302 and contact 102, the contact interface or couplingformed is robust and reliable.

It is also noted that the vertical PCB 304 is seated on top of thecontact 102 which show the efficient use of space by the contact on thehorizontal PCB 302. In other implementations, the contact 102 may engagea corner of the vertical PCB 304 rather than a side.

In FIG. 5, a perspective view 500 of the vertical PCB of 304 of FIG. 3is shown. The ground pads 308 and 310 wrap around the edge of PCB 304.The ground pads are shown to be drilled (or in other implementationsrouted) prior to be metalized (by coating or etching). As noted in FIG.4, the microstrip contact line 306 may also be seen as extending aroundthe edge of PCB 304.

Turning to FIG. 6, a perspective view 600 of a contact device 602between a vertical PCB 604 and horizontal PCB 606 in accordance withanother example implementation of an embodiment of the invention isshown. A microstrip 608 may be applied to the vertical PCB 604 thatwraps around the edge and results in wraparound metallization 610. Themicrostrip 608 may be plated through or stitched through a hole 612 tohelp secure the microsrtip to the vertical PCB 604. The contact device602 may be achieved with solder paste in between the microstrip 608 ofthe vertical PCB 604 and a pad or other electronic contact on thehorizontal PCB 606. The solder paste may be solidified during thesurface mounting of devices on the horizontal PCB 606. The solder pastein FIG. 6 is shown prior to solidifying.

In FIG. 7, a flow diagram 700 of an example application of the contactdevice 102 of FIG. 1 to a PCB 302 of FIG. 3 in accordance with anexample implementation of an embodiment of the invention is shown. Acontact area (microstrip contact lines 306 or pads 308 and 310) may beformed 702 on a vertical PCB (such as PCB 304). A contact device 102 maythen be placed upon the contact area, (microstrip contact lines 306 oron a pad) 704 on the main PCB board (such as PCB 302). The anchor point106 of the contact device 102 is then secured to main PCB board withsolder 706. This may be accomplished by initially securing the anchorpoint 106 and then flow soldering over the contact device 102. Othersoldering or electro-coupling may be employed such as riveting orscrewing.

Further, one or more of the vertical PCBs may have an antenna formed onor in it. In other implementations, the vertical PCB may be anothercircuit board that contains sub-assemblies of an electronic device. Thecontact device 102 is shown being mounted on the horizontal PCB, inother implementations the contact device may be mounted on the verticalPCB or a combination of both vertical and horizontal PCBs.

The invention illustratively disclosed herein suitably may be practicedin the absence of any element, part, step, component, or ingredientwhich is not specifically disclosed herein.

While in the foregoing detailed description this invention has beendescribed in relation to certain preferred embodiments thereof, and manydetails have been set forth for purposes of illustration, it will beapparent to those skilled in the art that the invention is susceptibleto additional embodiments and that certain of the details describedherein can be varied considerably without departing from the basicprinciples of the invention.

1-20. (canceled)
 21. An electrical system with at least two printedcircuit boards, comprising: a first printed circuit board (PCB) with atleast one electrical contact; a second PCB with at least one electricalcontact; at least one guide coupled to the first PCB that is able tosecure the first PCB against the second PCB; and an electricalconnection formed between the at least one electrical contact of thefirst PCB and the at least one electrical contact of the second PCB bysolder paste.
 22. The electrical system of claim 21, where the at leastone contact of the first PCB is a microstrip contact line extending toan edge of the vertical PCB and wrapping around the edge.
 23. Theelectrical system of claim 21, where the at least one contact of thefirst PCB is a ground pad that is wrapped around an edge of the firstPCB.
 24. The electrical system of claim 21, where the at least onecontact of the second PCB is a ground pad.
 25. The electrical system ofclaim 21, where the first PCB has at least one antenna formed on or init.
 26. A method of connecting a first printed circuit board (PCB) witha second PCB, comprising: forming a contact on the first PCB; forming acontact on the second PCB; positioning the contact on the first PCB in aphysical connection with the contact on the second PCB; and applyingsolder paste at the physical connection.
 27. The method of connecting afirst PCB with a second PCB of claim 26, further including the step ofsolidifying the solder paste.
 28. The method of connecting a first PCBwith a second PCB of claim 26, where positioning the contact on thefirst PCB in physical connection with the contact on the second PCBfurther includes coupling at least one guide to the first PCB that isable to secure the first PCB against the second PCB.
 29. The method ofconnecting a first PCB with a second PCB of claim 26, where forming acontact on the first PCB further includes affixing a microstrip on thefirst PCB.
 30. The method of connecting a first PCB with a second PCB ofclaim 26, where forming a contact on the first PCB further includesaffixing a ground pad on the first PCB that is wrapped around an edge ofthe first PCB.
 31. The method of connecting a first PCB with a secondPCB of claim 26 where forming a contact on the second PCB furtherincludes affixing a ground pad on the second PCB.
 32. The method ofconnecting a first PCB with a second PCB of claim 26, where the firstPCB has at least one antenna formed on or in it.